Critini Research analyst Jukan pointed out that Samsung and SK Hynix are re evaluating the timing of HBM hybrid bonding applications. JEDEC has relaxed the thickness standard of HBM5 to about 1000 μ m, loosening the 720 μ m standard of HBM3E and the 775 μ m standard of HBM4, making the hybrid bonding advantage no longer urgent. Samsung develops Heat Path Block, SK Hynix launches iHBM to replace hybrid bonding with independent heat dissipation solution. Nvidia does not have an urgent demand for stacking over 16 layers, and 12 layer products may be mainstream for HBM4E. The number of I/O in HBM4 has reached 2048, and the TC hot pressing process is approaching its limit. When the number of I/O in the future HBM5E stage increases to 4096, hybrid bonding will still be an inevitable direction, which will affect Besi's market expectations.