SEMI predicts that global investment in 300mm memory wafer fab equipment will reach $52 billion by 2026

SEMI predicts that global investment in 300mm memory wafer fab equipment will reach $52 billion by 2026, a year-on-year increase of 29%. Among them, the expenditure on DRAM devices was $37 billion, and the expenditure on NAND devices was $14 billion. The global investment in 300mm memory wafer fab equipment is expected to reach $57 billion by 2027, with a compound annual growth rate of 19% between 2024 and 2029.