[Korean Media: Samsung Electronics and SK Hynix May Delay Adoption of Next-Generation HBM Hybrid Bonding Technology] Odaily Planet Daily reports that, according to Korean media, Samsung Electronics and SK Hynix are reassessing the timeline for adopting hybrid bonding technology for the next generation of high-bandwidth memory (HBM). Due to a reduced demand for thickness reduction and improved thermal performance in HBM, the market expects the adoption timeline for this technology may be further delayed compared to previous expectations. Meanwhile, the two companies are separately developing new cooling solutions such as HPB and iHBM, with plans to apply them to HBM5 products. However, industry insiders believe that as the number of HBM I/O continues to increase in the future, hybrid bonding will remain an important technological route in the medium to long term.