[SemiAnalysis: SPHBM4 Shifts AI Chip Complexity to Substrate Layer] Odaily Planet Daily reports that SemiAnalysis posted on the X platform stating that SPHBM4 shifts the complex engineering burden of AI chips. Chip manufacturers will no longer purchase the extremely expensive proprietary 'silicon interposer + ABF substrate' combination but will instead fully transition to purchasing ultra-large, high-layer-count ABF substrates or adopt glass substrates early when performance demands are directly pushed to the substrate layer. The substrate boom has just begun.