Samsung builds hybrid bonding production line, expected to be used for Nvidia Feynman accelerator

Samsung Electronics is building a Die to Wafer hybrid bonding production line at its P5 factory in Pyeongtaek, with plans to purchase approximately 50 Besi produced hybrid bonding machines at a price of approximately 6 billion Korean won per unit. This technology replaces traditional hot press bonding with mixed copper bonding, and its core application scenario is customized HBM. Citrini analyst Jukan stated that hybrid bonding is expected to be used for Nvidia's next-generation AI accelerator Feynman, which uses customized HBM. Samsung expects to achieve large-scale applications from 2029 to 2030.